Seamless sleeve and seamless substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10265745
APP PUB NO 20150114062A1
SERIAL NO

14584945

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.

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Patent Owner(s)

Patent OwnerAddress
ILLINOIS TOOL WORKS INC155 HARLEM AVENUE GLENVIEW IL 60025

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Crawford-Taylor, Shannon K Merrillville, US 6 79
Deschner, Matthew J Downers Grove, US 4 6
Herring, William A Valparaiso, US 14 150
Jelonek, Paul R Geneva, US 4 71
Randazzo, Dean J Chicago, US 5 8
Sangkaratana, Suwit Crown Point, US 4 60
Spoto, Louis M Hampton Falls, US 17 127
Varacins, Alan J Burlington, US 11 56

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