Binderless metal injection molding apparatus and method

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United States of America Patent

PATENT NO 10265770
APP PUB NO 20150004047A1
SERIAL NO

14489328

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A metal injection molding apparatus includes a metal injection mold die having first and second die halves, a first set of features provided in the first die half, a second set of features provided in the second die half and complementary to the first set of features provided in the first are half and an ultrasonic transducer disposed in contact with the metal injection mold die. A binderless metal injection molding method is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
THE BOEING COMPANY100 NORTH RIVERSIDE PLAZA CHICAGO IL 60606-2016

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wilkinson, Carey E O'Fallon, US 12 103

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