Copper chloride, CVD raw material, copper wiring film, and method for producing copper chloride

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United States of America Patent

PATENT NO 10266952
APP PUB NO 20170101718A1
SERIAL NO

15316000

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Abstract

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Provided are: copper chloride which can provide an organometallic complex that contains impurities at a small content and therefore has high purity; a CVD raw material; a copper wiring film; and a method for producing copper chloride. Copper chloride which has purity of 6 N or more and has an Ag content of 0.5 wtppm or less.

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Patent Owner(s)

Patent OwnerAddress
JX NIPPON MINING & METALS CORPORATION6-3 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-8164

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kanou, Gaku Ibaraki, JP 7 76
Omori, Tatsuya Ibaraki, JP 21 262

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