Rework process and tool design for semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10269762
APP PUB NO 20170125374A1
SERIAL NO

14926780

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Abstract

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A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Justin Hsin-Chu, TW 44 207
Lin, Jing-Cheng Hsin-Chu, TW 565 14856
Lin, Shih Ting Taipei, TW 36 588
Tsai, Tsung-Fu Changhua, TW 82 372
Yu, Chen-Hua Hsin-Chu, TW 2036 41015

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