Package-on-package structure having polymer-based material for warpage control
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United States of America Patent
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Apr 23, 2019
Grant Date -
Jul 6, 2017
app pub date -
Mar 17, 2017
filing date -
Jun 29, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
The present disclosure relates to a package-on-package structure providing mechanical strength and warpage control. In some embodiments, the package-on-package structure includes a first set of conductive elements coupling a first package component to a second package component. A first molding material is arranged on the first package component. The first molding material surrounds the first set of conductive elements and outer sidewalls of the second package component and has a top surface below a top surface of the second package component. The stacked integrated chip structure further includes a second set of conductive elements that couples the second package component to a third package component.
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