Fan-out semiconductor package and photosensitive resin composition
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United States of America Patent
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May 7, 2019
Grant Date -
Apr 12, 2018
app pub date -
Jun 29, 2017
filing date -
Oct 10, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package.
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