Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices
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United States of America Patent
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May 14, 2019
Grant Date -
Aug 24, 2017
app pub date -
Apr 17, 2017
filing date -
Nov 30, 2011
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Abstract
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
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