Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

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United States of America Patent

PATENT NO 10287215
APP PUB NO 20170240475A1
SERIAL NO

15489014

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Abstract

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A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

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Patent Owner(s)

Patent OwnerAddress
COMPONENT RE-ENGINEERING COMPANY INC3508 BASSETT STREET SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Balma, Frank Los Gatos, US 23 189
Elliot, Alfred Grant Palo Alto, US 16 138
Elliot, Brent Donald Alfred Cupertino, US 15 138
Rex, Dennis George Williams, US 20 163
Schuster, Richard Erich Milpitas, US 15 138
Veytser, Alexander Mountain View, US 23 227

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