Ultrasonic probe and manufacturing method thereof
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United States of America Patent
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May 21, 2019
Grant Date -
Oct 29, 2015
app pub date -
Apr 23, 2015
filing date -
Apr 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.
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