Substrate carrier with integrated electrostatic chuck

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United States of America Patent

PATENT NO 10297483
APP PUB NO 20160196997A1
SERIAL NO

14916019

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Abstract

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A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Zuoqian Dublin, US 11 55
White, John M Hayward, US 380 22499

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