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United States of America Patent

PATENT NO 10319601
APP PUB NO 20180277384A1
SERIAL NO

15467866

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Abstract

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A slurry for chemical mechanical planarization includes water, 1-3 wt. % of abrasive particles having an average diameter of at least 10 nm and less than 100 nm and an outer surface of ceria, and ½-3 wt. % of at least one amine.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arnepalli, Ranga Rao Veeravalli post, IN 23 858
Goradia, Prerna Mumbai, IN 31 567
Lianto, Prayudi Singapore, SG 22 12
See, Guan Huei Singapore, SG 60 163
Sundarrajan, Arvind Singapore, SG 81 910
Visser, Robert Jan Menlo Park, US 127 2016
Zeng, Jie Singapore, SG 70 379

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