Low temperature high reliability alloy for solder hierarchy

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United States of America Patent

PATENT NO 10322471
APP PUB NO 20170197281A1
SERIAL NO

15326180

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Abstract

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A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

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Patent Owner(s)

  • ALPHA ASSEMBLY SOLUTIONS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhatkal, Ravindra Waterbury, US 2 8
Choudhury, Pritha Waterbury, US 9 24
De, Avila Ribas Morgana Waterbury, US 20 38
Mukherjee, Sutapa Waterbury, US 15 45
Pandher, Ranjit Waterbury, US 37 112
Sarkar, Siuli Waterbury, US 49 115
Singh, Bawa Waterbury, US 105 1434

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