Dynamic bonding of powder metallurgy materials
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United States of America Patent
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Jun 25, 2019
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N/A
app pub date -
Dec 29, 2015
filing date -
Dec 29, 2015
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Abstract
A dynamic compaction process comprises forming first and second preforms. Forming each preform includes utilizing a container having an interior and an exterior. Filling the interior of the container with a powder material; sealing the container; subjecting the exterior of the container to an instantaneous dynamic compaction, forming a solid powder metallurgy preform encased by the container. The container gets removed from each preform. The process includes inserting the first and second preforms in another container in a predefined pattern; the predefined pattern aligns the first and second preforms creating an interface. The process includes inserting a backstop against the predefined pattern in this container; subjecting the exterior of this container to an instantaneous dynamic compaction. The process includes bonding the first preform and second preform along the interface to form a component precursor; and removing the container from the precursor. Another step includes processing the precursor into components.
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