Nickel solution for forming film and film-forming method using same

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United States of America Patent

PATENT NO 10358734
APP PUB NO 20160237582A1
SERIAL NO

15026366

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Abstract

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A nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA-SHI AICHI-KEN 471-8571

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akamatsu, Kensuke Nagaokakyo, JP 14 53
Hiraoka, Motoki Toyota, JP 39 147
Sato, Yuki Nisshin, JP 214 716
Shimmei, Yoshitaka Nagoya, JP 1 1
Yanagimoto, Hiroshi Miyoshi, JP 42 152

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