Electronic component structures with reduced microphonic noise

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United States of America Patent

PATENT NO 10366836
APP PUB NO 20170025223A1
SERIAL NO

15285210

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Abstract

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An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

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Patent Owner(s)

Patent OwnerAddress
KEMET ELECTRONICS CORPORATION2835 KEMET WAY SIMPSONVILLE SC 29681

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bultitude, John Simpsonville, US 57 254
McConnell, John E Simpsonville, US 43 589
Miller, Galen W Simpsonville, US 8 11

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