Pre-applying supporting materials between bonded package components

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United States of America Patent

PATENT NO 10366971
APP PUB NO 20160172348A1
SERIAL NO

15047884

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Abstract

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A structure includes a first package component, and a second package component over and bonded to the first package component. A supporting material is disposed in a gap between the first package component and the second package component. A molding material is disposed in the gap and encircling the supporting material.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Guan-Yu Hsin-Chu, TW 60 224
Chen, Meng-Tse Changzhi Township, TW 100 1568
Chen, Yu-Feng Hsin-Chu, TW 119 1102
Hsu, Yu-Chen Hsin-Chu, TW 44 209
Pu, Han-Ping Taichung, TW 158 2964

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