Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium

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United States of America Patent

PATENT NO 10381320
APP PUB NO 20170110430A1
SERIAL NO

14915189

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Abstract

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The present invention provides a bonding wire which can satisfy bonding reliability, spring performance, and chip damage performance required in high-density packaging. A bonding wire contains one or more of In, Ga, and Cd for a total of 0.05 to 5 at %, and a balance being made up of Ag and incidental impurities.

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Patent Owner(s)

Patent OwnerAddress
NIPPON STEEL CHEMICAL & MATERIAL CO LTDTOKYO 103-0027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deai, Hiroyuki Tokyo, JP 7 44
Oda, Daizo Saitama, JP 61 213
Oyamada, Tetsuya Tokyo, JP 29 29
Uno, Tomohiro Tokyo, JP 109 711

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