Device and method for manufacturing emblem with incorporated IC chip
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United States of America Patent
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Aug 20, 2019
Grant Date -
Aug 3, 2017
app pub date -
May 2, 2014
filing date -
May 2, 2014
priority date (Note) -
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Abstract
A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.
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