Microscale three-dimensional electric devices and methods of making the same
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United States of America Patent
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Sep 3, 2019
Grant Date -
Oct 12, 2017
app pub date -
Apr 7, 2017
filing date -
Apr 8, 2016
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Abstract
Functionalized microscale 3D devices and methods of making the same. The 3D microdevice can be realized with the combination of top-down (lithographic) and bottom-up (origami-inspired self-assembly) processes. The origami-inspired self-assembly approach combined with a top-down process can realize 3D microscale polyhedral structures with metal/semiconductor materials patterned on dielectric materials. In some embodiments, the functionalized 3D microdevices include resonator-based passive sensors, i.e. split ring resonators (SRRs), on 3D, transparent, free-standing, dielectric media (Al2O3).
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