High quality, void and inclusion free alloy wire

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10421161
APP PUB NO 20170320172A1
SERIAL NO

15495375

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Abstract

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Disclosed herein is a method of forming an alloy material for use in a wire. The method includes forming a master alloy containing lead and silver; and creating a molten wire alloy by combining the master alloy, additional lead, and a third material in a vessel. The method also includes flowing argon gas through and over the molten wire alloy. The method also includes drawing the molten alloy from the vessel through an actively cooled die, and solidifying the molten wire alloy to form a bar of wire alloy.

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Patent Owner(s)

  • HONEYWELL INTERNATIONAL INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nolander, Ira G Spokane, US 6 36
Sina, Younes Spokane, US 2 0
Steele, David E Spokane, US 10 64
Turner, Erik L Spokane, US 2 1

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