Photosensitive resin and manufacturing method thereof

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United States of America Patent

PATENT NO 10465029
APP PUB NO 20190241692A1
SERIAL NO

15887527

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Abstract

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Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.

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Patent Owner(s)

Patent OwnerAddress
ENVISICS LLCCOLUMBIA CENTER 101 WEST BIG BEAVER ROAD TROY MI 48084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Qin, Tina Van Nuys, US 28 405
Wiensch, Joshua D Pasadena, US 28 417

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