Adhesive for processing a microelectronic substrate, and related methods

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United States of America Patent

PATENT NO 10465099
SERIAL NO

15799264

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Abstract

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Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

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Patent Owner(s)

Patent OwnerAddress
SEAGATE TECHNOLOGY LLC47488 KATO ROAD FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Habermas, Andrew Bloomington, US 18 178
Hoehn, Joel William Hudson, US 16 79
Khan, Zubair Ahmed Villa Park, US 6 3
Quach, Dat Savage, US 5 11

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