Device package including molding compound having non-planar top surface around a die

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10468377
APP PUB NO 20180033767A1
SERIAL NO

15717300

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Abstract

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A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interconnect structure over the die. The interconnect structure includes a redistribution layer extending onto the molding compound and conformal to the non-planar surface of the molding compound. The device package further includes a first connector disposed over the die and bonded to the interconnect structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Liu, Chung-Shi Hsinchu, TW 824 11367
Yu, Chen-Hua Hsinchu, TW 2207 47923

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