Method of calibrating a nanometrology instrument

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United States of America Patent

PATENT NO 10473692
APP PUB NO 20160091703A1
SERIAL NO

14860947

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Abstract

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A method of calibrating a topography metrology instrument using a calibration reference, which includes a substrate and a plurality of bi-layer stacks. Each bi-layer stack includes a plurality of bi-layer steps. At least one bi-layer step of the plurality of bi-layer steps includes two materials. The at least one bi-layer step of the plurality of bi-layer steps includes an etch stop layer and a bulk layer. The calibration reference includes a calibration reference step profile includes a plurality of predetermined bi-layer stack heights. The calibration reference step profile and the predetermined bi-layer stack heights are measured using a topography metrology instrument. The topography metrology instrument is calibrated based on the measured calibration reference step profile and the measured bi-layer stack heights.

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Patent Owner(s)

Patent OwnerAddress
THE GOVERNMENT OF THE UNITED STATES AS REPRESENTED BY THE SECRETARY OF THE NAVY875 N RANDOLPH ST SUITE 1425 ARLINGTON VA 22203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boudreau, Andrew J Washington, US 4 6
Christophersen, Marc Berwyn Heights, US 15 80
Phlips, Bernard F Great Falls, US 10 73
Yetzbacher, Michael K Burke, US 8 8

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