Method and apparatus for post exposure processing of photoresist wafers
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United States of America Patent
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Nov 12, 2019
Grant Date -
Dec 21, 2017
app pub date -
Aug 31, 2017
filing date -
Nov 30, 2015
priority date (Note) -
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Abstract
Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
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