Package on-package structure including a thermal isolation material and method of forming the same

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United States of America Patent

PATENT NO 10490539
APP PUB NO 20160343698A1
SERIAL NO

15228098

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Abstract

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A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ang, Ai-Tee Hsin-Chu, TW 27 224
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Kuei-Wei Hsin-Chu, TW 72 1278
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Tsai, Tsai-Tsung Taoyuan, TW 22 185

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