Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure

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United States of America

PATENT NO 10497651
SERIAL NO

15799757

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Abstract

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An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. An electromagnetic interference (EMI) shield is provided by a photonic bandgap (PBG) structure that is included within the encapsulation material. The PBG structure is configured to have a photonic bandgap with a frequency range approximately equal to a range of frequencies that may cause EMI.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cook, Benjamin Stassen Addison, US 165 747
Revier, Daniel Lee Addison, US 34 69

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