Apparatus for laser bonding of flip chip and method for laser bonding of flip chip

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United States of America

PATENT NO 10497665
SERIAL NO

16011649

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Abstract

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Provided are a flip chip laser bonding apparatus and a flip chip laser bonding method, and more particularly, to an apparatus and method for flip chip laser bonding, in which a semiconductor chip in a flip chip form is bonded to a substrate by using a laser beam. According to the flip chip laser bonding apparatus and the flip chip laser bonding method, even a semiconductor chip that is bent or is likely to bend may also be bonded to a substrate without contact failure of solder bumps by bonding the semiconductor chip to the substrate by laser bonding while pressurizing the semiconductor chip.

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Patent Owner(s)

  • PROTEC CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ahn, Geunsik Seoul, KR 7 9

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