Substrate structure, semiconductor structure and method for fabricating the same

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United States of America Patent

PATENT NO 10508020
APP PUB NO 20170129767A1
SERIAL NO

15411957

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Abstract

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The present disclosure provides a substrate structure for a micro electro mechanical system (MEMS) device. The substrate structure includes a cap and a micro electro mechanical system (MEMS) substrate. The cap has a cavity, and the MEMS substrate is disposed on the cap. The MEMS substrate has a plurality of through holes exposing the cavity, and an aspect ratio of the through hole is greater than 30.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Tsai-Hao Hsinchu, TW 38 51
Kuo, Shih-Chi Taoyuan, TW 55 156
Lee, Tsung-Hsien Tainan, TW 26 58
Liu, Tao-Cheng Hsinchu, TW 21 16

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