Etching method for manufacturing semiconductor device

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United States of America Patent

PATENT NO 10508343
APP PUB NO 20140090782A1
SERIAL NO

14097721

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Abstract

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An etching method includes: applying a radiation to an etching aqueous solution; and etching a material to be etched by using the etching aqueous solution irradiated with the radiation.

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Patent Owner(s)

  • FUJITSU LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ozaki, Shirou Kawasaki, JP 79 935

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