Semicondcutor package and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10510709
SERIAL NO

15491986

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package has at least one chip, through interlayer vias aside the chip and a composite molding compound encapsulating the chip and the through interlayer vias. The semiconductor package may further include a redistribution layer and conductive elements disposed on the redistribution layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Pingtung County, TW 100 1568
Hsieh, Ching-Hua Hsinchu, TW 265 2259
Lin, Chih-Wei Hsinchu County, TW 359 5145
Liu, Chung-Shi Hsinchu, TW 824 11367

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jun 17, 2027
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 17, 2031
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00