Wafer level transfer molding and apparatus for performing the same
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United States of America Patent
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Dec 24, 2019
Grant Date -
Feb 15, 2018
app pub date -
Oct 25, 2017
filing date -
Mar 2, 2012
priority date (Note) -
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Abstract
A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate.
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