Method and system for cleaning wafer and scrubber

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United States of America

PATENT NO 10522369
SERIAL NO

14632103

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Abstract

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A method of cleaning a wafer in semiconductor fabrication is provided. The method includes cleaning a wafer using a wafer scrubber. The method further includes moving the wafer scrubber into an agitated cleaning fluid. The method also includes creating a contact between the wafer scrubber and a cleaning stage in the agitated cleaning fluid. In addition, the method includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning fluid.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chen-Liang New Taipei, TW 5 25
Chen, Po-Chia Taichung, TW 1 7
Chuang, Shun-Yu Taichung, TW 3 13
Hsieh, Ju-Ru Taipei, TW 3 9
Hu, Chien-Chun Taichung, TW 3 7
Lin, Wei-Tuzo Taichung, TW 1 7

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