Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates

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United States of America

PATENT NO 10522452
SERIAL NO

13276143

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Abstract

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Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Kuei-Wei Hsin-Chu, TW 72 1278
Lin, Chih-Wei Xinfeng Township, TW 359 5145
Lin, Chun-Cheng New Taipei, TW 100 1465
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Ching-Shi Hsin-Chu, TW 1 2

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