Dielectric film
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Jan 7, 2020
Grant Date -
Oct 19, 2017
app pub date -
Sep 24, 2015
filing date -
Sep 24, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention is a film capacitor comprising a dielectric film and a metal layer, the dielectric film being a resin film obtained by stretching an unstretched film produced using a crystalline hydrogenated dicyclopentadiene ring-opening polymer, and heating the resulting stretched film, and the resin film having a softening point of 250 to 320° C., a thermal shrinkage ratio of 0.01 to 5.0% when heated at 200° C. for 10 minutes, a loss tangent (tan δ) of 0.0001 to 0.0010, and a coefficient of static friction of 0.01 to 1.00. The present invention provides a film capacitor that includes a resin film as a dielectric film, the resin film exhibiting excellent heat resistance, excellent withstand voltage properties, and excellent workability.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully