Chip resistor and paste for forming resist layer of chip resistor

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10541069
APP PUB NO 20190164672A1
SERIAL NO

16193608

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Abstract

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A paste for forming a resist layer of a resistor includes: a copper-based alloy powder; and nickel (Ni) powder in an amount greater than 0 wt % of the copper-based alloy powder and less than or equal to 10 wt % of the copper-based alloy powder, wherein the paste is glass-free.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU GYEONGGI-DO SUWON-SI 16674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yun, Jang-Seok Suwon-si, KR 1 2

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