Package structure of capacitive coupling isolator
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United States of America
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Jan 21, 2020
Grant Date -
Aug 1, 2019
app pub date -
Oct 19, 2018
filing date -
Oct 19, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.
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