Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment
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United States of America
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Jan 28, 2020
Grant Date -
Nov 8, 2018
app pub date -
Mar 1, 2018
filing date -
Mar 1, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.
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