Antenna Module
Number of patents in Portfolio can not be more than 2000
United States of America
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Jan 28, 2020
Grant Date -
Jun 6, 2019
app pub date -
May 7, 2018
filing date -
May 7, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.
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