Ring-shaped electrode

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United States of America

PATENT NO 10553405
APP PUB NO 20190172687A1
SERIAL NO

16322954

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Abstract

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A ring-shaped electrode includes a silicon ring body, and a cover body joined to at least a part of a surface of the ring body via a joining part, and having a better plasma resistance than silicon. The joining part has a heat resistance to withstand a temperature of at least 150° C., melts at 700° C. or below, and contains boron oxide.

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Patent Owner(s)

Patent OwnerAddress
THINKON NEW TECHNOLOGY JAPAN CORPORATIONTOKYO 176-0012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Satoshi Tokyo, JP 135 1614
Ikari, Atsushi Shunan, JP 21 617

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