Ceramic electronic component and mount structure therefor
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 11, 2020
Grant Date -
Dec 27, 2018
app pub date -
Jun 25, 2018
filing date -
Jun 25, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A ceramic electronic component includes an electronic component body and portions of first and second metal terminals defined by lead wires covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protruding bending portions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.
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