Package on package structure and method for forming the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10559546
APP PUB NO 20190131261A1
SERIAL NO

16233218

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Abstract

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Some embodiments relate to a semiconductor device package, which includes a substrate with a contact pad. A non-solder ball is coupled to the contact pad at a contact pad interface surface. A layer of solder is disposed over an outer surface of the non-solder ball, and has an inner surface and an outer surface which are generally concentric with the outer surface of the non-solder ball. An intermediate layer separates the non-solder ball and the layer of solder. The intermediate layer is distinct in composition from both the non-solder ball and the layer of solder. Sidewalls of the layer of solder are curved or sphere-like and terminate at a planar surface, which is disposed at a maximum height of the layer of solder as measured from the contact pad interface surface.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDNO 8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Lii, Mirng-Ji Sinpu Township, TW 254 6304
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsinchu, TW 824 11367
Yu, Chen-Hua Hsinchu, TW 2207 47923

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