Semiconductor device and method for manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10566292
APP PUB NO 20180366414A1
SERIAL NO

16114566

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Abstract

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A semiconductor device includes a first semiconductor layer, a second semiconductor layer, a first pad, and a second pad. A first opening and a second opening are formed in a first main surface of the first semiconductor layer. The second semiconductor layer is stacked on the first semiconductor layer. The first pad for wire bonding is disposed in the first opening. The second pad on which an alignment mark is formed is disposed in the second opening. A third opening and a fourth opening penetrate the second semiconductor layer. The first opening overlaps the third opening. The second opening overlaps the fourth opening.

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Patent Owner(s)

  • OLYMPUS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takazawa, Naohiro Tokyo, JP 11 61

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