Manufacturing method of semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 18, 2020
Grant Date -
Nov 8, 2018
app pub date -
Nov 2, 2016
filing date -
Nov 2, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
The disclosure includes: a first lifting step for bonding a wire at a first position (13) with a capillary and for lifting the capillary up to a first height H1 while feeding the wire; a circular arc lifting step for carrying out a circular arc motion for moving the capillary in a circular arc toward a second position (14) by a first distance (L5), and then carrying out a lifting motion for lifting the capillary while feeding the wire; a circular arc motion step for moving the capillary in a circular arc toward the first position (13) by a second distance (L3+L4); a second lifting step for lifting the capillary up to a second height H4; and a looping step for looping the capillary to the second position (14), thereby forming a wire loop having a predetermined height on a substrate by bonding the wire at the second position (14).
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