Apparatus for direct transfer of semiconductor device die
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 18, 2020
Grant Date -
Nov 14, 2019
app pub date -
Jul 26, 2019
filing date -
Jul 26, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.
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