Rapid response sensor housing
Number of patents in Portfolio can not be more than 2000
United States of America
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Feb 25, 2020
Grant Date -
Apr 28, 2016
app pub date -
Oct 23, 2015
filing date -
Oct 23, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A sensor assembly is provided that includes a housing having a unitary body with a proximal end portion and a distal end portion. The distal end portion is open and defines an internal cavity exposed to an outside environment, and the proximal end portion defines a plurality of internal passageways that extend and open into the internal cavity. A thin film resistive temperature device (RTD), or other micro-sensor, is disposed within the internal cavity, the thin film RTD having a plurality of lead wires that extend through the plurality of internal passageways, and the thin film RTD being in contact with at least one wall of the internal cavity. The thin film RTD and the lead wires are secured within the housing by a thermal adhesive having a matched coefficient of thermal expansion with that of the housing and the thin film RTD substrate.
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