Electronic package including cavity formed by removal of sacrificial material from within a cap
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United States of America
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Feb 25, 2020
Grant Date -
Oct 5, 2017
app pub date -
Mar 29, 2017
filing date -
Mar 29, 2017
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of fabricating an electronic component includes forming a functional unit on a main surface of a substrate, forming a sacrificial layer covering the functional unit on the main surface, forming a cap layer covering the sacrificial layer, the cap layer forming a periphery enclosing the cavity on the main surface, forming holes through the cap layer, forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface, and forming a first resin layer covering the cap layer and the main surface.
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