Solder paste misprint cleaning

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10576566
APP PUB NO 20170348784A1
SERIAL NO

15173751

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Importance

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Abstract

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A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dong, Xingquan Shenzhen, CN 7 13
Hou, Yanlong Shenzhen, CN 9 11
Mu, LiCen Shenzhen, CN 12 25
Wu, Ben Shenzhen, CN 45 499
Zhang, WeiFeng Shenzhen, CN 60 79

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