Power supply wiring in a semiconductor memory device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10580463
APP PUB NO 20190295605A1
SERIAL NO

16380912

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Abstract

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The present disclosure relates generally to the field of power supply wiring in a semiconductor device. In one embodiment, a semiconductor device is disclosed that includes, an uppermost metal layer including a power supply enhancing wiring, power supply wiring coupled to the power supply enhancing wiring through a via between the uppermost metal layer and a metal layer underlying the uppermost metal layer, and at least one memory device component disposed in vertical alignment with the via between the uppermost metal layer and the metal layer underlying the uppermost metal layer.

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Patent Owner(s)

  • MICRON TECHNOLOGY INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishizaki, Mamoru Yokohama, JP 15 43

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