Connection structure and method for manufacturing connection structure

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10580751
APP PUB NO 20190237424A1
SERIAL NO

16004302

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Abstract

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A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on the first electrode and a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member, and curing the first composite and the second composite.

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Patent Owner(s)

  • MIKUNI ELECTRON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Sakae Saitama, JP 96 842

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