Silicon carbide microelectromechanical structure, device, and method

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10589983
SERIAL NO

15698604

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Abstract

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Electromechanical device structures are provided, as well as methods for forming them. The device structures incorporate at least a first and second substrate separated by an interface material layer, where the first substrate comprises an anchor material structure and at least one suspended material structure, optionally a spring material structure, and optionally an electrostatic sense electrode. The device structures may be formed by methods that include providing an interface material layer on one or both of the first and second substrates, bonding the interface materials to the opposing first or second substrate or to the other interface material layer, followed by forming the suspended material structure by etching.

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Patent Owner(s)

  • THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bernstein, Jonathan Medfield, US 35 1056
Cook, Eugene Melrose, US 6 41
Hobart, Karl D Alexandria, US 73 2485
Imhoff, Eugene A Washington, US 12 58
Kub, Francis J Arnold, US 108 3767
Myers-Ward, Rachael L Spriingfield, US 17 54
Weinberg, Marc Needham, US 11 344

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